ASICLAND Makes First Appearance at 2024 TSMC OIP Ecosystem Forum, Strengthening Global Collaborations
▶ Participating in Taiwan’s OIP Ecosystem Forum Alongside GUC, Alchip, SK Hynix, and Other Semiconductor Companies Expanding
▶ Global Operations through Continuous Cooperation with TSMC and OIP Partners via Taiwan R&D Center
[2024-11-06] ASICLAND will participate in the 2024 TSMC Open Innovation Platform (OIP) Ecosystem Forum for the first time.
ASICLAND (445090), a leading ASIC design solution company led by CEO Lee Jong-min, announced on November 6 that it will join the 2024 TSMC Open Innovation Platform Ecosystem Forum, organized by TSMC, the world's largest semiconductor foundry. Through this participation, the company aims to accelerate global business cooperation opportunities.
The TSMC OIP Ecosystem Forum is a platform for TSMC and its OIP partners to share the latest technology advancements and explore industry trends. The forum will be held across six regions, including the U.S., Japan, Taiwan, China, Europe, and Israel, with an expected attendance of over 6,000 participants representing 750 companies, including GUC, Alchip, and SK Hynix. Key topics will cover the impact of AI on chip design transformations, advancements in 3DIC system design, and more.
TSMC has developed a robust ecosystem that includes IP providers, EDA tool companies, and design houses to facilitate efficient, collaborative development, delivering semiconductor design solutions optimized for fabless companies. As the only TSMC VCA (Value Chain Aggregator) in Korea, ASICLAND provides a one-stop turnkey solution that encompasses the entire semiconductor process from development to production.
At this forum, ASICLAND plans to strengthen its connections with OIP partners and expand business cooperation opportunities. The company will also use this platform to raise brand awareness and secure marketing opportunities by showcasing its capabilities to potential clients.
ASICLAND CEO Lee Jong-min stated, "Our first participation in the TSMC OIP Ecosystem Forum marks a significant step toward continuous collaboration with TSMC and OIP partners. We will leverage our Taiwan R&D center to drive technological innovation and expand our global operations."
Additionally, ASICLAND has established an advanced R&D center in Hsinchu, Taiwan, to attract top talent and advance 3nm and 5nm design capabilities, along with CoWoS (Chip-on-Wafer-on-Substrate) packaging technology.
▲ASICLAND executives at the TSMC OIP Ecosystem Forum booth.
(from left: Lee Jong-min, CEO; Lee Seok-joo, Vice President; Song Ki-chul, DI Division Head)
ASICLAND Makes First Appearance at 2024 TSMC OIP Ecosystem Forum, Strengthening Global Collaborations
▶ Participating in Taiwan’s OIP Ecosystem Forum Alongside GUC, Alchip, SK Hynix, and Other Semiconductor Companies Expanding
▶ Global Operations through Continuous Cooperation with TSMC and OIP Partners via Taiwan R&D Center
[2024-11-06] ASICLAND will participate in the 2024 TSMC Open Innovation Platform (OIP) Ecosystem Forum for the first time.
ASICLAND (445090), a leading ASIC design solution company led by CEO Lee Jong-min, announced on November 6 that it will join the 2024 TSMC Open Innovation Platform Ecosystem Forum, organized by TSMC, the world's largest semiconductor foundry. Through this participation, the company aims to accelerate global business cooperation opportunities.
The TSMC OIP Ecosystem Forum is a platform for TSMC and its OIP partners to share the latest technology advancements and explore industry trends. The forum will be held across six regions, including the U.S., Japan, Taiwan, China, Europe, and Israel, with an expected attendance of over 6,000 participants representing 750 companies, including GUC, Alchip, and SK Hynix. Key topics will cover the impact of AI on chip design transformations, advancements in 3DIC system design, and more.
TSMC has developed a robust ecosystem that includes IP providers, EDA tool companies, and design houses to facilitate efficient, collaborative development, delivering semiconductor design solutions optimized for fabless companies. As the only TSMC VCA (Value Chain Aggregator) in Korea, ASICLAND provides a one-stop turnkey solution that encompasses the entire semiconductor process from development to production.
At this forum, ASICLAND plans to strengthen its connections with OIP partners and expand business cooperation opportunities. The company will also use this platform to raise brand awareness and secure marketing opportunities by showcasing its capabilities to potential clients.
ASICLAND CEO Lee Jong-min stated, "Our first participation in the TSMC OIP Ecosystem Forum marks a significant step toward continuous collaboration with TSMC and OIP partners. We will leverage our Taiwan R&D center to drive technological innovation and expand our global operations."
Additionally, ASICLAND has established an advanced R&D center in Hsinchu, Taiwan, to attract top talent and advance 3nm and 5nm design capabilities, along with CoWoS (Chip-on-Wafer-on-Substrate) packaging technology.