ASICLAND Establishes Local Subsidiary in Taiwan, Accelerating Global Market Entry with Cutting-Edge Process Technology
▶ Expanding Global Market Presence at the Heart of Semiconductor Innovation
▶ Establishing a Strategic Foothold for U.S. Market Entry
[2024-08-26] ASICLAND (445090), a leading global provider of application-specific integrated circuit (ASIC) design solutions, announced the establishment of a new subsidiary in Hsinchu City, Taiwan. This subsidiary will serve as a cutting-edge research and development (R&D) center focused on securing 3-nanometer (nm) and 5-nanometer (nm) design technology, along with advanced CoWos (Chip-on-Wafer-on-Substrate) packaging technology.
To bolster its local presence and technological expertise, ASICLAND has recruited top-tier Taiwanese talent with extensive experience in advanced process design, including 2nm and 3nm technologies, as well as 2.5D and 3D packaging. Leveraging this expertise, ASICLAND aims to strengthen its capabilities and position itself as a global market leader.
Taiwan is a pivotal hub in the global semiconductor industry, boasting world-class infrastructure and a robust technology ecosystem, particularly through its association with TSMC. ASICLAND plans to harness Taiwan's strategic advantages to drive technological innovation and enhance its standing in the global semiconductor market. This move into Taiwan marks a significant strategic milestone in the expansion of ASICLAND’s global R&D network.
Additionally, ASICLAND intends to leverage its Taiwanese subsidiary to actively pursue opportunities in the U.S., Asian, and Chinese markets. The company aims to expand its market share and strengthen its influence in the global semiconductor market by implementing strategies and technologies tailored to each specific region.
ASICLAND CEO Jong-min Lee stated, "The establishment of our subsidiary in Taiwan is a crucial step for ASICLAND's technological innovation and global market expansion. We will maximize synergy through collaboration with our R&D centers in Korea and Taiwan, and this will pave the way for our entry into the U.S. market, the world's largest."
Through continuous technological development and innovation at its Taiwanese R&D center, located in proximity to TSMC, ASICLAND is poised to solidify its leadership in the global semiconductor industry.
ASICLAND Establishes Local Subsidiary in Taiwan, Accelerating Global Market Entry with Cutting-Edge Process Technology
▶ Expanding Global Market Presence at the Heart of Semiconductor Innovation
▶ Establishing a Strategic Foothold for U.S. Market Entry
[2024-08-26] ASICLAND (445090), a leading global provider of application-specific integrated circuit (ASIC) design solutions, announced the establishment of a new subsidiary in Hsinchu City, Taiwan. This subsidiary will serve as a cutting-edge research and development (R&D) center focused on securing 3-nanometer (nm) and 5-nanometer (nm) design technology, along with advanced CoWos (Chip-on-Wafer-on-Substrate) packaging technology.
To bolster its local presence and technological expertise, ASICLAND has recruited top-tier Taiwanese talent with extensive experience in advanced process design, including 2nm and 3nm technologies, as well as 2.5D and 3D packaging. Leveraging this expertise, ASICLAND aims to strengthen its capabilities and position itself as a global market leader.
Taiwan is a pivotal hub in the global semiconductor industry, boasting world-class infrastructure and a robust technology ecosystem, particularly through its association with TSMC. ASICLAND plans to harness Taiwan's strategic advantages to drive technological innovation and enhance its standing in the global semiconductor market. This move into Taiwan marks a significant strategic milestone in the expansion of ASICLAND’s global R&D network.
Additionally, ASICLAND intends to leverage its Taiwanese subsidiary to actively pursue opportunities in the U.S., Asian, and Chinese markets. The company aims to expand its market share and strengthen its influence in the global semiconductor market by implementing strategies and technologies tailored to each specific region.
ASICLAND CEO Jong-min Lee stated, "The establishment of our subsidiary in Taiwan is a crucial step for ASICLAND's technological innovation and global market expansion. We will maximize synergy through collaboration with our R&D centers in Korea and Taiwan, and this will pave the way for our entry into the U.S. market, the world's largest."
Through continuous technological development and innovation at its Taiwanese R&D center, located in proximity to TSMC, ASICLAND is poised to solidify its leadership in the global semiconductor industry.