ASICLAND Participates in SEDEX 2024, Showcasing Global Vision Rooted in Advanced ASIC Design Services
▶ Strengthening market presence through unveiling latest developments in Edge AI and automotive solutions
▶ Presenting vision for global business expansion and advanced process technology via Taiwan R&D center
[2024-10-23] ASICLAND is showcasing its cutting-edge semiconductor technology and recent achievements at SEDEX 2024 (Semiconductor Exhibition 2024).
ASICLAND (445090, CEO Lee Jong-min), a leader in ASIC (Application-Specific Integrated Circuit) design solutions, announced its participation in SEDEX 2024, held from October 23 to 25 at COEX in Samseong-dong, Seoul. The company will highlight its advanced technology capabilities developed through its R&D center in Taiwan and share its vision for global business expansion, with a focus on AI, memory, and automotive semiconductor solutions.
Organized by the Korea Semiconductor Industry Association (KSIA), SEDEX 2024 is South Korea’s largest semiconductor exhibition, celebrating its 26th anniversary this year. With over 250 participating companies and more than 600 booths, the event serves as a critical platform for showcasing advancements across the semiconductor ecosystem. As South Korea’s only TSMC Value Chain Alliance (VCA) member and an ARM Approved Design Partner (ADP), ASICLAND aims to use SEDEX 2024 as an opportunity to strengthen strategic alliances with global semiconductor leaders while presenting its latest advancements in Edge AI and automotive solutions.
At its SEDEX booth, ASICLAND will introduce three key platforms: Aworld Magic™, ALPS™ , and TOAST™ .
Aworld Magic™ is an in-house SoC design automation platform, providing an integrated development environment with a GUI that reflects ASICLAND’s unique Spec-in and turnkey solution expertise.
ALPS™ is a backend design automation platform that offers detailed process reports for precise error correction and efficient project management.
TOAST™ , a one-stop development solution optimized for on-device AI environments with video processing units, supports the entire development cycle—from architecture design to chip testing and mass production—thereby enhancing time-to-market.
ASICLAND CEO Lee Jong-min noted, "The growing demand for low-power, high-performance chip solutions in the AI, memory, and automotive markets underscores the need for advanced semiconductor technology. Through our participation in SEDEX 2024, we aim to showcase ASICLAND’s technological strength and reinforce strategic partnerships to further solidify our position as a global leader in ASIC solutions."
Meanwhile, ASICLAND is accelerating efforts to secure top talent and advanced technology in 3nm and 5nm design, as well as CoWos (Chip-on-Wafer-on-Substrate) packaging capabilities, through its R&D center in Hsinchu, Taiwan.
▲ASICLAND Exhibition Booth at SEDEX (Semiconductor Exhibition) 2024
ASICLAND Participates in SEDEX 2024, Showcasing Global Vision Rooted in Advanced ASIC Design Services
▶ Strengthening market presence through unveiling latest developments in Edge AI and automotive solutions
▶ Presenting vision for global business expansion and advanced process technology via Taiwan R&D center
[2024-10-23] ASICLAND is showcasing its cutting-edge semiconductor technology and recent achievements at SEDEX 2024 (Semiconductor Exhibition 2024).
ASICLAND (445090, CEO Lee Jong-min), a leader in ASIC (Application-Specific Integrated Circuit) design solutions, announced its participation in SEDEX 2024, held from October 23 to 25 at COEX in Samseong-dong, Seoul. The company will highlight its advanced technology capabilities developed through its R&D center in Taiwan and share its vision for global business expansion, with a focus on AI, memory, and automotive semiconductor solutions.
Organized by the Korea Semiconductor Industry Association (KSIA), SEDEX 2024 is South Korea’s largest semiconductor exhibition, celebrating its 26th anniversary this year. With over 250 participating companies and more than 600 booths, the event serves as a critical platform for showcasing advancements across the semiconductor ecosystem. As South Korea’s only TSMC Value Chain Alliance (VCA) member and an ARM Approved Design Partner (ADP), ASICLAND aims to use SEDEX 2024 as an opportunity to strengthen strategic alliances with global semiconductor leaders while presenting its latest advancements in Edge AI and automotive solutions.
At its SEDEX booth, ASICLAND will introduce three key platforms: Aworld Magic™, ALPS™ , and TOAST™ .
Aworld Magic™ is an in-house SoC design automation platform, providing an integrated development environment with a GUI that reflects ASICLAND’s unique Spec-in and turnkey solution expertise.
ALPS™ is a backend design automation platform that offers detailed process reports for precise error correction and efficient project management.
TOAST™ , a one-stop development solution optimized for on-device AI environments with video processing units, supports the entire development cycle—from architecture design to chip testing and mass production—thereby enhancing time-to-market.
ASICLAND CEO Lee Jong-min noted, "The growing demand for low-power, high-performance chip solutions in the AI, memory, and automotive markets underscores the need for advanced semiconductor technology. Through our participation in SEDEX 2024, we aim to showcase ASICLAND’s technological strength and reinforce strategic partnerships to further solidify our position as a global leader in ASIC solutions."
Meanwhile, ASICLAND is accelerating efforts to secure top talent and advanced technology in 3nm and 5nm design, as well as CoWos (Chip-on-Wafer-on-Substrate) packaging capabilities, through its R&D center in Hsinchu, Taiwan.