ASICLAND Patners with Taiwan's Egis Technology for Global AI Server Chip Co-Development
▶ Targeting Advanced IO Chiplet Solutions to Capture the High-Performance Data Center
▶ Market Strengthening Global Market Presence Through Collaboration with Key International Partners
[2024-11-06] ASICLAND has announced a new partnership with Taiwan’s Egis Technology to strategically enter the high-performance data center market.
ASICLAND (445090), a leading ASIC design solutions provider represented by CEO Lee Jong-min, has signed a strategic partnership agreement with Egis Technology Inc. (hereafter referred to as Egis), a key player in AI and high-performance computing semiconductor solutions, to co-develop AI High-Performance Computing (HPC) server chips.
▲ASICLAND and Egis Group representatives sign an MOU for global AI server chip co-development at ASICLAND's Taiwan office.
(Left: Egis Group Chairman Steve Ro., Right: ASICLAND CEO Lee Jong-min.)
The primary goal of this partnership is to create advanced Input/Output (IO) chiplet solutions aimed at high-performance data centers. The companies plan to collaborate on essential technologies, including “CPU chips,” “AI chips,” “IO chips,” “IP licenses (UCIe, LPDDR5, PCIE5/6),” and advanced CoWoS packaging technology.
Initially, the focus will be on developing IO chips by combining ASICLAND’s ASIC chip design expertise with TSMC’s advanced process technology and Egis’s “UCIe” and “LPDDR5 IP” technologies. This development is planned to start in Korea and eventually expand to global markets to boost both companies' global competitiveness.
Egis is known for its innovative semiconductor solutions tailored to next-generation AI and high-performance computing technologies, including chiplet architectures that enhance its competitiveness worldwide. The company has been strengthening its technological capabilities through partnerships with industry leaders like Arm and the continuous advancement of high-speed interface IP technology, including AI server solutions and UCIe.
ASICLAND CEO Lee Jong-min commented, “Through this partnership with Egis, we aim to enhance critical technologies required in the high-performance data center market and boost our competitiveness on a global scale. We will continue collaborating with global partners to showcase our unique technological strengths, especially in advanced semiconductor processes.”
ASICLAND Patners with Taiwan's Egis Technology for Global AI Server Chip Co-Development
▶ Targeting Advanced IO Chiplet Solutions to Capture the High-Performance Data Center
▶ Market Strengthening Global Market Presence Through Collaboration with Key International Partners
[2024-11-06] ASICLAND has announced a new partnership with Taiwan’s Egis Technology to strategically enter the high-performance data center market.
ASICLAND (445090), a leading ASIC design solutions provider represented by CEO Lee Jong-min, has signed a strategic partnership agreement with Egis Technology Inc. (hereafter referred to as Egis), a key player in AI and high-performance computing semiconductor solutions, to co-develop AI High-Performance Computing (HPC) server chips.
(Left: Egis Group Chairman Steve Ro., Right: ASICLAND CEO Lee Jong-min.)
The primary goal of this partnership is to create advanced Input/Output (IO) chiplet solutions aimed at high-performance data centers. The companies plan to collaborate on essential technologies, including “CPU chips,” “AI chips,” “IO chips,” “IP licenses (UCIe, LPDDR5, PCIE5/6),” and advanced CoWoS packaging technology.
Initially, the focus will be on developing IO chips by combining ASICLAND’s ASIC chip design expertise with TSMC’s advanced process technology and Egis’s “UCIe” and “LPDDR5 IP” technologies. This development is planned to start in Korea and eventually expand to global markets to boost both companies' global competitiveness.
Egis is known for its innovative semiconductor solutions tailored to next-generation AI and high-performance computing technologies, including chiplet architectures that enhance its competitiveness worldwide. The company has been strengthening its technological capabilities through partnerships with industry leaders like Arm and the continuous advancement of high-speed interface IP technology, including AI server solutions and UCIe.
ASICLAND CEO Lee Jong-min commented, “Through this partnership with Egis, we aim to enhance critical technologies required in the high-performance data center market and boost our competitiveness on a global scale. We will continue collaborating with global partners to showcase our unique technological strengths, especially in advanced semiconductor processes.”