ASICLAND Selected for National Chiplet Project in Partnership with Dnotitia — Driving Commercialization of CFaaS
▶ National R&D project worth approximately USD 12.8 million to develop core chiplet technologies that reduce development burdens for fabless companies
▶ ASICLAND to launch “CFaaS (Chiplet Foundry-as-a-Service)” turnkey platform — targeting both technological excellence and business scalability
[June 5, 2025] In the era of AI semiconductors, ASICLAND is strengthening both its technological potential and profitability by advancing chiplet design capabilities and laying the foundation for its CFaaS business model.
ASICLAND (445090), a leading ASIC design solutions provider led by CEO Lee Jong-min, announced on June 5 that it has been selected as a co-research organization for a major national R&D project titled “Development of Interface Technology for Chiplet-Based AI Data Processing and Validation Technology for Large AI Chiplet Modules.”
The project, overseen by the Ministry of Science and ICT and the Institute of Information & Communications Technology Planning & Evaluation (IITP), is valued at approximately USD 12.8 million. ASICLAND will collaborate with the lead institution, Dnotitia, to execute the project.
While chiplet-based high-performance semiconductor design is rapidly gaining traction among global tech giants, small and mid-sized fabless companies in Korea still face challenges in accessing and utilizing such technologies. Despite chiplets offering advantages in design flexibility and yield improvement, most are developed in-house by large companies and are difficult to reuse as standardized IP. This forces smaller firms to shoulder the full burden of chip development — from high-speed interface design to verification — both financially and technically.
To address this, the project aims to develop a comprehensive chiplet system implementation framework using UCIe 2.0-based interfaces and 2.5D CoWoS packaging technology. ASICLAND will lead the development of key interface and packaging technologies, including:
- Validation of I/O hub chiplet architecture
- Back-end design
- Interposer material and structure design
- SI/PI integrity analysis and chip verification
Chiplet interface technology enables the separation of monolithic chips into modular functions, allowing more efficient interaction between units — a foundational requirement for high-performance, low-power AI computing systems.
Furthermore, ASICLAND plans to accelerate commercialization of its turnkey chiplet platform business, CFaaS (Chiplet Foundry-as-a-Service), in collaboration with Dnotitia. The CFaaS offering will provide fabless clients with a one-stop solution, integrating all development stages — from I/O chiplet and interface IP, to advanced packaging and SDK support — based on their proprietary core designs. The platform aims to shorten development cycles, reduce costs, and optimize performance, ultimately delivering significant value to customers.
To support this roadmap, ASICLAND is internalizing advanced process capabilities such as 3nm and 5nm node technologies and CoWoS packaging via its Taiwan R&D center. The company was also recently selected for another national project in April focused on the development of an on-device AI-optimized chiplet-based hub SoC, further validating its technical expertise and market positioning.
CEO Lee Jong-min stated “As the semiconductor industry shifts toward a chiplet-centric paradigm, we are securing both technological differentiation and strong execution capabilities.”
“Through this project, we will drive the CFaaS platform business forward and lead the next generation of the semiconductor market.”
ASICLAND Selected for National Chiplet Project in Partnership with Dnotitia — Driving Commercialization of CFaaS
▶ National R&D project worth approximately USD 12.8 million to develop core chiplet technologies that reduce development burdens for fabless companies
▶ ASICLAND to launch “CFaaS (Chiplet Foundry-as-a-Service)” turnkey platform — targeting both technological excellence and business scalability
[June 5, 2025] In the era of AI semiconductors, ASICLAND is strengthening both its technological potential and profitability by advancing chiplet design capabilities and laying the foundation for its CFaaS business model.
ASICLAND (445090), a leading ASIC design solutions provider led by CEO Lee Jong-min, announced on June 5 that it has been selected as a co-research organization for a major national R&D project titled “Development of Interface Technology for Chiplet-Based AI Data Processing and Validation Technology for Large AI Chiplet Modules.”
The project, overseen by the Ministry of Science and ICT and the Institute of Information & Communications Technology Planning & Evaluation (IITP), is valued at approximately USD 12.8 million. ASICLAND will collaborate with the lead institution, Dnotitia, to execute the project.
While chiplet-based high-performance semiconductor design is rapidly gaining traction among global tech giants, small and mid-sized fabless companies in Korea still face challenges in accessing and utilizing such technologies. Despite chiplets offering advantages in design flexibility and yield improvement, most are developed in-house by large companies and are difficult to reuse as standardized IP. This forces smaller firms to shoulder the full burden of chip development — from high-speed interface design to verification — both financially and technically.
To address this, the project aims to develop a comprehensive chiplet system implementation framework using UCIe 2.0-based interfaces and 2.5D CoWoS packaging technology. ASICLAND will lead the development of key interface and packaging technologies, including:
Chiplet interface technology enables the separation of monolithic chips into modular functions, allowing more efficient interaction between units — a foundational requirement for high-performance, low-power AI computing systems.
Furthermore, ASICLAND plans to accelerate commercialization of its turnkey chiplet platform business, CFaaS (Chiplet Foundry-as-a-Service), in collaboration with Dnotitia. The CFaaS offering will provide fabless clients with a one-stop solution, integrating all development stages — from I/O chiplet and interface IP, to advanced packaging and SDK support — based on their proprietary core designs. The platform aims to shorten development cycles, reduce costs, and optimize performance, ultimately delivering significant value to customers.
To support this roadmap, ASICLAND is internalizing advanced process capabilities such as 3nm and 5nm node technologies and CoWoS packaging via its Taiwan R&D center. The company was also recently selected for another national project in April focused on the development of an on-device AI-optimized chiplet-based hub SoC, further validating its technical expertise and market positioning.
CEO Lee Jong-min stated “As the semiconductor industry shifts toward a chiplet-centric paradigm, we are securing both technological differentiation and strong execution capabilities.”
“Through this project, we will drive the CFaaS platform business forward and lead the next generation of the semiconductor market.”